Model: VCF-760 series

• Designed for blind via hole filling process
• Filling ratio up to 90%
• Good for high aspect ratio board

FEATURES

• Conductivity: 0.59 mega-ohm/cm
• Elongation: meet IPC-650 standard ＞15%
• Tensile Strength: meet IPC-650 standard ＞30Kpsi
• Thermal Shock: 6 cycles with NO cracking (288°C, 10sec)
• Good Metal Distribution
• Brightness: flat, smooth and bright
• Uniform Current Density: 1.0 to 0 A/dm²
• Additives analysis: use CVS(Cyclic Voltametric Stripping System)